Integrating the Worlds of Micro and Macrotechnology
The exchange of material and information with MEMS is more complex than with standard microelectronic chips. GeSiM offers customized solutions for packaging, liquid handling and instrument design.
- Hybrid integration of Si or glass chips in ceramic of other wire bonding mounts,
- Innovative electrical, fluidic and mechanical joining technology,
- Integration of macrofluidic components (E.g. valves, pumps) or custom-specific parts,
- Development of hard- and software,
- Customization of GeSiM standard instruments.