Miscellaneous

Further MEMS Services

Microgalvanics

Galvanic deposition of thick layers of Ni (70 µm), Au (70 µm), Au (10 µm), after lift-off microstructuring

 

Screen Printing

  • Printing of SMD adhesives or silicone rubber on PCBs and microsystem substrates
  • Including sieve design and production
  • Typical thickness: 15 – 35 µm