Thin Film Services

Coating Technologies

GeSiM offers the deposition of conducting and insulating films by

  • Physical Vapor Deposition
  • Plasma-Enhanced Chemical Vapor Deposition
  • Screen Printing


Physical Vapor Deposition (PVD) by Magnetron Sputtering and Electron Beam Deposition

Can be applied to different materials:

  • Conductive materials: Aluminum (Al), titanium (Ti), platinum (Pt), tantalum (Ta):- Thickness from 0 to 200 Nanometers.
    – Resistance in the micro ohm range.
    – Patterning by lift-off and etching technologies.
    – Single-layer or multi-layer coating of these materials.
  • Conductive and transparent material ITO-90/10 (90% indium oxide In2O3 and 10% tin oxide SnO2):
    – Thickness from 20 to 200 Nanometers.
    – Resistance from 30 to 50 Ohm.
    – Patterning by lift-off and etching technologies.
  • Evaporated quartz SixOy, coated at 150° C.

a) Platinum electrodes on glass, b) Thin film platinum resistors on a cantilever silicon nitride membrane, c) Aluminum metallization on a silicon chip, d) Gold electrodes on glass (From left to right)


Plasma Enhanced Chemical Vapor Deposition (PECVD)

  • Silicon oxide SiO2, silicon nitride Si3N4 and low stress oxinitride SixOyNz as alternative insulator materials:- Thickness from 20 Nanometers to 1.5 Microns.

    – Patterning by RIE dry etching and wet chemical etching.

  • Hydrofluorocarbon CxFy layers. Material similar to Teflon®:
    – Thickness range from 50 Nanometers to 2 Microns.
    – Patterning by O2 RIE plasma etching.

PVD and PECVD applies to all kind of substrates up to 4 inch diameter.


Screen Printing

  • Dispensing of the state of the art adhesives on printed circuit boards and micro system substrates for surface mounted device packaging.
  • Dispensing of silicon rubber.
  • Includes sieve design and production.
  • Typical thickness of printed materials in the range of 15 to 35 Microns.