Wafer Dicing Service

From the Batch Process to tiny Pieces

GeSiM accepts flat wafers with diameters up to 6 inch, furthermore tubes and objects of other geometries (please ask).

 

Substrate Materials

  • Silicon (up to 2 mm thick)
  • Different glasses (up to 1.5 mm thick)
  • Different Ceramics (up to 1.5 mm thick)
  • Stainless Steel (up to 1.0 mm thick)

 

Support

  • Pressure sensitive tapes
  • UV-curing tapes
  • Dicing wax
a) Glass capillary, diced into pieces of 1.5 mm length, b) Miniature mirrors, diced from a metallized 4 inch glass wafer, c) TEM cross section of a diced piece

a) Glass capillary, diced into pieces of 1.5 mm length, b) Miniature mirrors, diced from a metallized 4 inch glass wafer, c) TEM cross section of a diced piece (From left to right)